CORRON

Water Guide Laser Machine

WL90

Ultra-precision cutting of thick materials by projecting a laser onto a waterjet
revents thermal deformation and damage to parent material due to the cooling effect of water
Precision machining of various materials such as metal, SI, SIC, etc.
Provides smooth cutting surface without burrs and secondary contamination

Innovative fusion processing of laser and waterjet using the total reflection characteristics of light

Fusing two technologies by coupling a laser into a waterjet
Minimized heat affected zone (HAZ) due to water, resulting in minimal deformation
Materials thicker than 15mm can also be processed
Has excellent processing perpendicularity compared to traditional laser processing
Very small slot machining down to 0.06 mm is possible
Processable depth (based on 4kW)

- Si < 12T

- SiC < 8T

- Al < 18T

- Steel < 10T

Sample 1
Ultra High Temperature Ceramics (UHTC)
Components for semiconductor heater equipment
Sample 2
SiC material
Cutting and grooving of semiconductor equipment jig parts
Sample 3
SUS304 0.2T material
Semiconductor equipment components
Sample 4
Al 6063 0.1T material
Ø0.06 ~ Ø0.3 hole processing test sample
Sample 5
SUS304 3T material
Semiconductor equipment parts minimum slotting width 0.06mm
Sample 6
Si 4T material
Semiconductor CSR parts slotting processing sample